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Hardware Engineer

Duties

 

  • Semiconductor Package development for AR/VR Si 

Skills

 

o    Experience in Advanced package development in CSP, BGA, WLCSP, Fan-out, SiP; familiarity with Flip Chip, Wafer-level Packaging and 3D/ TSV technologies; 

o    Expereince with package mech design, reliability testing, qualification and failure modes/failure analysis.

o    Experience with package manufacturing technology i.e. FMEA, DFM, Yield management

 

 

Education


  • BS, MS or PhD in Engineering or Materials Science
 
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